The present invention relates to a physical vapour deposition apparatus for depositing substantially uniform coatings on a substrate, comprising: a deposition chamber; a rotary shaft disposed at centre of said deposition chamber; a substrate holder coupled to the rotary shaft, for holding the substrate; a heater coupled to the rotary shaft above the substrate holder, for heating the substrate; a magnetron assembly for sputtering of electron ions on a deposit; a pump, for generating and providing a vacuum-like atmosphere in the physical vapour deposition apparatus; and characterised by: a shutter positioned above the magnetron assembly for controlling exposure of a coating material to an ion bombardment; the magnetron assembly comprises of a first magnet stack positioned in centre of said magnetron assembly; a second magnet stack positioned at periphery of said magnetron for enhancing electrons during deposition; a cooling block; an insulator; and a power supply means.