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A Packaged Micro-Electro-Mechanical System (MEMS) Devices

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Reg. ID : 16371
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Description

The present invention relates in general to Micro-Electro-Mechanical Systems (MEMS) devices but more particularly to packaged MEMS devices with polysilicon encapsulation.

Contact Person/Inventor

Name Email Contact Phone
Burhanuddin Yeop Majlis Fasc burhan@ukm.edu.my 03-89265861

Intellectual Property

Type of IP Registration ID
1 Patent Granted PI 20064264

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