A Packaged Micro-Electro-Mechanical System (MEMS) Devices
Potential Commercialised
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Reg. ID : 16371
Comments
Description
The present invention relates in general to Micro-Electro-Mechanical Systems (MEMS) devices but more particularly to packaged MEMS devices with polysilicon encapsulation.
Contact Person/Inventor
| Name | Contact Phone | |
|---|---|---|
| Burhanuddin Yeop Majlis Fasc | burhan@ukm.edu.my | 03-89265861 |
Intellectual Property
| № | Type of IP | Registration ID |
|---|---|---|
| 1 | Patent Granted | PI 20064264 |
Award
| Award Title | Award Achievement | Award Year Received |
|---|---|---|
| 0 | 0 | 0 |
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Organisation Name
- UNIVERSITI KEBANGSAAN MALAYSIAUKM43600BANGI
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