Skip to main content

A Method Of In-Situ Targeted Interfacial Alloying Of Lead- Free Solder Joints

Potential Commercialised fa-solid fa-cart-arrow-down violet
Reg. ID : 16654
Comments

Huraian

The present invention discloses an in-situ targeted alloying method to reactively dissolve metallic nanoparticles at the solder-substrate interface to control the morphology and growth of intermetallic compounds (IMC) thickness by dispersing metallic nanoparticles into a carrier in lead-free microelectronic assemblies. An in-situ targeted alloying method comprises placing the carrier dispersed with metallic nanoparticles on the substrate, followed by placing and heating lead-free solder alloys on top of the nanoparticles doped carrier to form desired solder joint at the solder-substrate interface.

Contact Person/Inventor

Name Email Contact Phone
Um Centre Of Innovation And Enterprise (Umcie) umcie@um.edu.my 013-2250151 / 03-79677351

Intellectual Property

Type of IP Registration ID
1 Patent Filed PI2018702515

Award

Award Title Award Achievement Award Year Received
0 0 0

Komen

LOG IN or REGISTER to post comments.

Star Rating

Star Rating
Masih tiada undi

Contact Form